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          1. UL /IEC/ EN 60950 Test Probe Kits BND-TPK01

            Product Description:UL /IEC/ EN 60950 IEC61032 Test Probe KitsModel:BND-TPK01Product Details:The BND-TPK-01 contains the devices listed in the core of the UL / IEC / EN 60950 requirements. It includes the following:· IEC Jointed Finger Probe (w/ banana jack in handle) (BND-B)· 50mm Impact Test Ball (BND-G500R)
            Description

            Product Description:

            UL /IEC/ EN 60950 IEC61032 Test Probe Kits

            Model:BND-TPK01


            Product Details:

            The BND-TPK-01 contains the devices listed in the core of the UL / IEC / EN 60950 requirements. It includes the following:

            · IEC Jointed Finger Probe (w/ banana jack in handle) (BND-B)

            · 50mm Impact Test Ball (BND-G500R)

            · Test Pin Probe: short (BND-13)

            · Rigid Finger Probe (BND-11)

            · Ball Pressure Tester (BND-QY102)

            · Telecom Test Probe (BND-TB12)

            Meets Requirements for Testing Standard(s) including but not limited to:IEC 60950EN 60950UL 60950CSA 950


            Datasheets of BND-TPK01 test probe kit:


            test probe B 1.jpgIEC61032  IEC60950  IEC60335
            IEC60529  IEC60045  IEC60884
            IEC60745
            Knurled Finger Diameter:12mm
            Knurled Finger Length:80mm
            Baffle Plate Diameter:50mm
            Baffle Plate Length:100mm
            Baffle Thickness:20mm
            BND-G500R
            Test Sphere 500G with ring
             2.jpgIEC61032  IEC60529Diameter:50mm
            Weight:227g
            BND-13
            Short Test Pin
             3.jpgIEC60065
            IEC60335
            IEC61032
            The probe Diameter:Head 3mm Tail 4mm
            The probe Length:15mm
            Dam-board Diameter:25mm
            Dam-board Thickness:4mm
            BND-11
            Rigid Test Probe 11
             4.jpgIEC61032
            IEC60065
            IEC60335
            IEC60884
            Nodular Finger Length:80mm
            Nodular Finger Diameter:12mm
            Dam-board Diameter:50mm
            Dan-board Thickness:5mm
            BND-TB12
            12mm Telecom Test Probe
             5.jpgIEC60065 IEC60695 IEC60950Probe Diameter:12mm
            Probe Length:80mm
            Baffle Plate Diameter:50mm
            BND-QY102
            Ball Pressure Apparatus
             6.jpgIEC60695-10-2 IEC60884
            IEC60320 IEC60335
            IEC60598
            IEC60950
            Ball diameter:5MM
            Total test pressure:20N±0.2N
            Samples bearing Diameter:50mm,Length:100mm Solid stainless steel cylinder



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